Two Temperature Model Numerical Simulation and Analysis of Thermal Transport Process in Copper Film

Thermal transport process in copper film was numerically simulated with Two-Temperature Model, in which finite difference method was used, and the result shown the temperature change process in electron-lattice system. Some parameters were changed to carry on further simulation. The affect of film thickness on the electronic relaxation time was analyzed. The affect of pump laser beam power on the electron temperature rise was discussed. The influence of electron-lattice coupling factor G on non-equilibrium thermal process was shown in simulations.