Conductive polymer/metal composites for interconnect of flexible devices
JAPANESE JOURNAL OF APPLIED PHYSICS(2015)
摘要
An interconnect of flexible and foldable devices based on advanced electronics requires high electrical conductivity, flexibility, adhesiveness on a plastic substrate, and efficient productivity. In this study, we investigated the applicability of a conductive polymer/metal composite to the interconnect of flexible devices. By combining an inkjet process and a photochemical reaction, micropatterns of a polypyrrole/silver composite were formed on flexible plastic substrates with an average linewidth of approximately 70 mu m within 10 min. The conductivity of the composite was improved to 6.0 x 10(2)Omega(-1).cm(-1). From these results, it is expected that the conducting polymer/metal composite can be applied to the microwiring of flexible electronic devices. (C) 2015 The Japan Society of Applied Physics
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