Statistical Evaluation of Electromigration Reliability at Chip Level
IEEE Transactions on Device and Materials Reliability, pp. 86-91, 2011.
Chip level electromigration (EM) reliability is determined by: 1) the element level EM failure probability used for design guideline generation; and 2) the distribution of EM elements against design limits. Balancing these two factors is critical for a chip design to achieve the best performance while maintaining chip level EM reliability...More
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