Electrical properties of Ag/Ta and Ag/TaN thin-films

Shabnam Mardani,Daniel Primetzhofer,Lina Liljeholm,Orjan Vallin,Hans Norstrom,Jorgen Olsson

Microelectronic Engineering（2014）

引用 7|浏览20

暂无评分

摘要

•Silver shows promise for interconnections at high temperatures.•Metal stacks, consisting of silver on either Ta or TaN were investigated up to 800°C.•Both systems showed stable performance up to 600°C.•At 700°C Ag/Ta is more stable than Ag/TaN.

查看译文

关键词

Interconnect,Silver,Thermal stability,Ta and TaN diffusion barrier

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要