Rdl Manufacturing For Flip Chip Packaging

Brett Williams, Deborah Florence, H Dalai, Krishna Gunturu,M E Nelson,Chuck Belisle

2005 IEEE Workshop on Microelectronics and Electron Devices（2005）

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摘要

The RDL processing module provides an interconnect redistribution layer (RDL) used in flip chip packaging. The processing of this RDL module is explained in detail along with the design rules used. RDL processing is shown to be very robust both structurally and electrically. This technique is compared with the industry to show the unique benefits of the AMIS methodology.

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关键词

component, metalization, flip-chip devices, integrated circuit interconnections, alundnum conductors

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