Placement of Thermal Vias in 3D ICs using Various Thermal Objectives ABSTRACTBrent Goplen,Sachin S Sapatnekarmag(2008)引用 23|浏览16暂无评分关键词thermal gradient,design,placement,routing,performance,finite element analysis,temperatureAI 理解论文溯源树样例生成溯源树,研究论文发展脉络Chat Paper正在生成论文摘要