New Method Of Particle Management By High-Sensitivity Ispm

2011 INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING (ISSM) AND E-MANUFACTURING AND DESIGN COLLABORATION SYMPOSIUM (EMDC)(2011)

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摘要
• The particles condition was able to be understood more precisely by using the new ISPM. • When there are exchange parts, the in-situ cleaning to emphasize gas viscosity can be effective • The in-situ cleaning condition be optimized by using the new ISPM. • In conclusion, one of the keys to achieve the particle management is using high-sensitivity ISPM.
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关键词
sensitivity,dry etching,collaboration,manufacturing,semiconductor lasers
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