Thermal modeling of three-dimensional integrated circuits considering the thermal removal capabilityHua Ding,Wei Wang,Zhiliang Qian,Chiying Tsui,Liangzhen Laimag(2011)引用 22|浏览2暂无评分关键词three dimensional,integrated circuit,finite volume,through silicon viaAI 理解论文溯源树样例生成溯源树,研究论文发展脉络Chat Paper正在生成论文摘要