Ion-Beam Treatment Effects on Peel Strength of Sputter-deposited Cu film and FR-4 SubstrateKyoung Jin Min,Sung Chul Park, K W Lee, Jae Dong Kim,Do Geun Kim,Gun Hwan Lee,Young Bae Parkmag(2008)引用 23|浏览3暂无评分关键词copper,adhesionAI 理解论文溯源树样例生成溯源树,研究论文发展脉络Chat Paper正在生成论文摘要