Enhanced architectural interconnect options enabled with flipped die on a multi-chip package Gerald Keith Bartley, Darryl John Becker,Paul Eric Dahlen, Philip Raymond Germann, Andrew B Maki, Mark Owen Maxsonmag（2012）引用 26|浏览0暂无评分AI 理解论文溯源树样例生成溯源树，研究论文发展脉络Chat Paper正在生成论文摘要
