Improvement of lumen efficiency in white light-emitting diodes by roughened-dispensing package

ieee international nanoelectronics conference(2011)

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摘要
White light-emitting diodes (LEDs) with roughened-dispensing package through a simple imprinting technique are demonstrated and fabricated. The imprinting mold was fabricated by naturally wet-etched (100) Si substrate, which did not require expensive lens mold and pattern definition. The lumen output of roughened-dispensing package was enhanced by 5.4 % and 2.5 %, at driving current of 120 mA, compared to reference flat phosphor-dispensing package without and with lens molding, respectively.
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关键词
electronics packaging,package,imprinting,light emitting diodes,rough surfaces,phosphors,led,lenses,light emitting diode,silicon,si,surface roughness,phosphor
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