Megasonic Cleaning For Particle Removal

PARTICLE ADHESION AND REMOVAL(2015)

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摘要
This chapter covers fundamental aspects of megasonic cleaning with special emphasis on acoustic cavitation and streaming. The first part of the chapter focuses on various forms of cavitation (stable and transient) and streaming (Eckart, Schlichting, and Rayleigh) and their physical effects in liquids including microstreaming, shock waves, and liquid microjets. A review of studies by several researchers on the role of various sound field and solution parameters on particle removal and feature damage during megasonic cleaning is provided in the second part of the chapter. The importance of understanding the cleaning mechanisms and optimization of process variables in achieving damage-free and effective megasonic cleaning process is also highlighted.
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关键词
Megasonic cleaning,silicon wafer,particle removal,acoustic streaming,acoustic cavitation
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