Thermal Expansion Coefficient of Cr(Ti)-Diamond/Copper Composites Prepared by Pressureless Infiltration

Ti(Cr)-diamond/copper composites were fabricated by infiltrating liquid copper into porous diamond preforms without pressure. Thermal expansion properties were measured from 50 to 500 degrees C by high-precision thermomechanical analyzer. The examination results were analyzed and compared to the predictions of theoretical models. The results indicate that the CTE of Cr(Ti)-diamond/copper composites are among 2-8x10(-6)k(-1), and the increase trend of CTE of Cr-diamond/copper composites is slower than that of Ti-diamond/copper composites with an increase of temperature. The Turner or German theoretical model are more suitable for designing and evaluating the CTEs of Ti(Cr)-diamond/copper composites.