THERMAL MODULE ACCOUNTING FOR INCREASED BOARD/DIE SIZE IN A PORTABLE COMPUTERBrett W Degner, Gavin J Reid, Brandon S Smith, Raymond S Shanmag(2015)引用 23|浏览1暂无评分AI 理解论文溯源树样例生成溯源树,研究论文发展脉络Chat Paper正在生成论文摘要