Equivalent-Circuit Models Of Via Interactions In Electronics Packaging

Proceedings of IEEE Symposium on Electromagnetic Compatibility（1994）

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摘要

This paper presents the SPICE-type of equivalent circuit models for via interactions between conducting planes. These equivalent circuit models are derived from the radial transmission line theory. Transient simulation results from SPICE with our models are in excellent agreement with those from the inverse Fourier transformation of frequency domain solutions. These models can be used in various applications, such as the simulation of Delta-I noise in electronics packaging.< >

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关键词

equivalent circuit models,electronics packaging,SPICE,interactions,conducting planes,radial transmission line theory,transient simulation results,inverse Fourier transformation,frequency domain solutions,Delta-I noise,IC technology,chip packages

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