Tubeless packaging of field emission display using glass to glass electrostatic bonding technology
international vacuum microelectronics conference(1998)
摘要
Glass-to-glass electrostatic bonding has been developed for tubeless packaging of field emitter arrays (FEAs). Amorphous silicon film was deposited on 0080 glass by means of RF sputtering method. In order to investigate the applicability of this bonding technique to in-situ vacuum packaging of FED, the hermetic sealing test of FED panel whose exhausting hole was sealed by this technique was accomplished under 10/sup -7/ torr vacuum level.
更多查看译文
关键词
radio frequency,glass,vacuum level,field emission,field emission display,electrostatics,si,packaging
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要