Resistance Instability inCu-damascene Structures during theIsothermal Electromigration Test

M Impronta,Sandro Farris, Antonio Ficola,A Scorzoni

2005 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP, FINAL REPORT（2005）

引用 0|浏览4

暂无评分

摘要

The Isothermal Test is a promising wafer-level tool to characterize electromigration also in Cu-damascene metallizations, when a correct temperature determination is employed. In this work an improved feedback algorithm is proposed to reduce the observed resistance instability in the stress phase, when the copper structures are approaching the failure.

查看译文

关键词

electromigration,copper,thermal resistance

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要