Digital Integrated Circuit Design: Physical Design

mag(2008)

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schottky junction,zener diode,gate oxide,sram,body,current density,latch up,ringing,leakage current,nanocircuits,probe card,pn junction,sheet resistance,flip chip,processing,bypass capacitor,doping,layout design,testing,thyristor,fuse,macro,process,turnaround time,depletion region,interconnect,electromigration,guard,cell,process variation,gate,ground bounce,operating temperature,yield,emitter,diode,fowler nordheim tunneling,floorplan,package,gate dielectric,sorting,electronic,optoelectronic devices,threshold voltage,capacitor,carrier mobility,crosstalk,standard cell,aspect ratio,encapsulation,heat spreader,lateral diffusion,radiation,core,dopant,floorplanning,lithography,wire bonding,bjt,photomask,salicide,wafer,source
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