Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages Jeffrey T Coffin,Michael A Gaynes,David L Questad,Kamal K Sikka, Hilton T Toy, Jamil Wakilmag(2008)引用 30|浏览1暂无评分AI 理解论文溯源树样例生成溯源树,研究论文发展脉络Chat Paper正在生成论文摘要