A base-band to RF BiCMOS transmitter RFIC for dual-band CDMA/AMPS wireless handsets

Kamal Sahota,Kevin G Gard,Brenton Walker, Sandor Szabo, Wenjun Su,Eric Zeisel

2000 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium Digest of Papers (Cat. No.00CH37096)（2000）

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摘要

A single chip, base-band to RF, BiCMOS transmitter RFIC (RFT3100) for dual-band CDMA/AMPS wireless handsets is presented. The RFIC contains base-band I/Q modulator, UHF VCO buffer, IF PLL, VCO, IF and RF VGAs, image rejection RF upconverter, dual driver amplifiers for cellular and PCS bands, and a three wire serial interface to control the chip. The chip operates from a 2.7 to 3.3 V supply, a temperature range of -30 to 85/spl deg/C, and is packaged in a 32 lead 5/spl times/5 mm bump chip carrier (BCC) package. The chip is fabricated using a 18 GHz (analog NPN ft), 0.5 um BiCMOS process.

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关键词

base-band to RF transmitter,BiCMOS transmitter RFIC,dual-band CDMA/AMPS wireless handsets,RFT3100,base-band I/Q modulator,UHF VCO buffer,IF PLL,image rejection RF upconverter,dual driver amplifiers,PCS bands,three wire serial interface,bump chip carrier package,BCC package,-30 to 85 C,2.7 to 3.3 V,0.5 micron

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