A flexible top metal structure to improve ultra low-k reliability

K F Cheng, C L Teng,H Y Huang,H C Chen,C W Shih, T H Liu,C H Tsai, C W Lu, Y H Wu,H H Lee, M H Lee, Ming H Hsieh, B L Lin,S Y Hou,C J Lee,H H Lu, T I Bao, S L Shue, C H Yu

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)（2015）

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摘要

High stresses generated from chip-package interactions (CPI), especially when large die is flip mounted on organic substrate using Pb-free C4 bumps, can easily cause low-k delamination. A novel scheme by applying an elastic material can effectively reduce the transmitted stresses and, thus, resolve the interfacial delamination issue. Along with an optimized chip-package integration solution, a reliable interconnect structure with good electrical performance, has been successfully demonstrated.

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关键词

flexible top metal structure,ultra low-k reliability,chip-package interactions,CPI,low-k delamination,elastic material,interfacial delamination issue,optimized chip-package integration solution

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