The Hybrid Method Is Introduced To Use In Suppression To Synchronous Switch Noise In High-Speed

2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY(2015)

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摘要
In this paper, a novel plane of electromagnetic bandgap (EBG) structure for wideband mitigation of simultaneous switching noise (SSN) based on the modern packaging materials and embedded technology. From the simulated and measured results of the proposed EBG structure, a wideband suppression of SSN ranges from 0.1 GHz to 20GHz is achieved with a high mitigation level of -40 dB. Furthermore, the influence of the proposed power plane of EBG structure on the signal integrity (SI) is investigated in the time and frequency domains, respectively. The results show that the SI performance can be improved significantly by using differential pairs for the signals.
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关键词
embedded technology,electromagnetic bandgap structure (EBG),power integrity (PI),signal integrity (SI),differential pair
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