Prospects of Thin-Film Thermoelectric Devices for Hot-Spot Cooling and On-Chip Energy Harvesting

Sri Harsha Choday,Mark S Lundstrom,Kaushik Roy

IEEE Transactions on Components, Packaging and Manufacturing Technology（2013）

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摘要

Advances in thin-film thermoelectric (TE) materials have created opportunities for using TE devices in high heat flux applications such as hot-spot (H-S) cooling and on-chip energy harvesting. In this paper, we compare the performance of TE modules integrated directly on the silicon die with those that are attached to the heat spreader of the chip package. We make use of the Bi2Te3/Sb2Te3 super la...

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关键词

Thin film devices,Superlattices,Thermoelectric devices,Energy harvesting,Finite element analysis

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