Higher compressive strengths and the Bauschinger effect in conformally passivated copper nanopillars

Our current understanding of size-dependent strength in nano- and microscale crystals is centered around the idea that the overall strength is determined by the stress required to propagate dislocation sources. The nature and type of these dislocation sources is the subject of extensive debate, however, one commonality amongst these theories is that the ability of the free surface to absorb dislocations is a necessary condition for transition to a source controlled regime. In this work we demonstrate that atomic layer deposition (ALD) of conformal 5–25nm thick TiO2/Al2O3 coatings onto electroplated single crystalline copper pillars with diameters ranging from 75nm to 1μm generally inhibits the ability of a dislocation to vanish at the free surface. Uniaxial compression tests reveal increased strength and hardening relative to uncoated pillars at equivalent diameters, as well as a notable recovery of plastic strain during unloading, i.e. the Bauschinger effect. Unlike previous reports, these coated pillars retained the stochastic signature in their stress–strain curves. We explain these observations within the framework of a size-dependent strength theory based on a single arm source model, dislocation theory, and microstructural analysis by transmission electron microscopy.