Novel Plasma Process for Build-Up Film in the Fine Wiring Fabrication
Electronic Components and Technology Conference（2022）
Key words
component,advanced package,build-up film,plasma treatment,RDL,build-up writing layer,desmear,surface morphology control,adhesion strength
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined