Electronic-photonic integration in the helios project

J M Fedeli,Franz Schrank,Wim Bogaerts,A Masood,Lars Zimmermann,E Augendre,Stephane Bernabe,Jochen Kraft,J Van Olmen,D Sabuncuoglu Tezcan, Ph Grosse, T Enot

Group IV Photonics（2013）

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摘要

Different ways of integrating of integrating photonics and electronics at the wafer level scale are reviewed: Monolithic, Back-Side, and Front-Side integration. Type and volume applications are selection criteria.

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关键词

bicmos integrated circuits,integrated optoelectronics,wafer-scale integration,helios project,backside integration,electronic-photonic integration,monolithic integration,wafer level scale

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