Investigation of an on product high-k/metal metrology methodology using an in-line, high throughput XPS measurement technique

Advanced Semiconductor Manufacturing Conference(2010)

引用 2|浏览40
暂无评分
摘要
In this paper, we investigated a novel and unique, high throughput, inline XPS technique for thin film (<; 100 A) measurements, such as SiON and HfO2. Inline XPS measurement capability was evaluated using four separate techniques; offline SIMS, offline XPS, inline ellipsometry and inline micro X-ray fluorescence (XRF). A Nitrogen sensitivity test determined that the detection limit was on the order of 5×13 atm/cm2 in a thin SiON layer. The success of decoupling the thickness of the bi-layer HfO2/SiON/Si film was demonstrated. Long term dynamic precision and short term repeatability for high-k film measurements are also discussed for both thickness and composition. These values were determined to be less than 1% of the nominal value (1sigma).
更多
查看译文
关键词
x-ray fluorescence analysis,x-ray photoelectron spectra,ellipsometry,hafnium compounds,high-k dielectric thin films,silicon compounds,thickness measurement,hfo2-sion-si,high throughput inline xps measurement,high-k film measurement,inline ellipsometry,inline micro x-ray fluorescence,long term dynamic precision,metal metrology,nitrogen sensitivity test,offline sims,offline xps,short term repeatability,thickness decoupling,thin film measurement,detection limit,process control,thin film,high throughput,silicon,nitrogen,hafnium,films,x ray fluorescence
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要