Design considerations for radio frequency 3DICs

Yingcheng Tseng,Changbao Chang,Chinkhai Tang,Chihsuan Cheng,Yichang Lu,Kunyou Lin,Tzonglin Wu,Rueybeei Wu

Electrical Design of Advanced Packaging and Systems Symposium（2012）

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摘要

In this paper, we first compare different configurations of RF 3DICs. Through simulations, we research how different TSV geometries affect the dissipation loss, coupling effect, and group delay of RF signals. We also study electromigration issues of power TSVs. Finally, we demonstrate a TSV spiral inductor with a Q factor of 14.9.

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关键词

radiofrequency integrated circuits,three-dimensional integrated circuits,q factor,rf 3dic,rf signal,tsv geometry,tsv spiral inductor,coupling effect,dissipation loss,electromigration,group delay,power tsv,radio frequency 3dic

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