Novel solder-on-pad (SoP) technology for fine-pitch flip chip bonding

Kwangseong Choi,Sunwoo Choo,Jongjin Lee,Kijun Sung, Hyunchel Bae,Byeongok Lim,Jongtae Moon,Yongsung Eom

Electronic Packaging Technology & High Density Packaging（2010）

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摘要

Solder-on-pad (SoP) technology gives the fine-pitch flip chip bonding manufacturability and reliability. For the SoP technology with pitch equal to or less than 150 μm pitch, there are many candidates. The cost-effectiveness will be one of the major criteria determining the industry preference. A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology (SoP) of the fine pitch flip chip bonding. With this material, the solder bump array was successfully formed with pitch of 150 μm in one direction.

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关键词

bonding processes,copper alloys,flip-chip devices,silver alloys,solders,tin alloys,snagcu,bumping material,fine-pitch flip chip bonding manufacturability,fine-pitch flip chip bonding reliability,maskless solder-on-pad technology,resin,solder bump array,flip chip,packaging,cost effectiveness,powders,heating

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