New High-Density Differential Split Gate Flash Memory With Self-Boosting Function

Electron Device Letters, IEEE(2013)

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摘要
This letter presents a novel high density differential split gate flash memory with self-boosting function realized by 0.18- μm embedded memory technology from Taiwan Semiconductor Manufacturing Company. The cell has a pair of symmetric floating gates to perform differential read for storage electrons in the dual gate. Besides, a simple and nondecoding self-boosting operation is built in to automatically boost threshold levels of the symmetric cells to prevent a long-term charge loss or data degradation problem. Since the cell process and tip erase structure are totally inherited from the proven split-gate flash technology, the highly efficient program and erase performances are remained in the new cell. This implemented self-boosting operation provides a promising solution for reliable embedded memory for advanced CMOS technology.
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cmos memory circuits,flash memories,integrated circuit reliability,random-access storage,taiwan semiconductor manufacturing company,advanced cmos technology,cell process,data degradation,differential read,dual gate,embedded memory technology,high-density differential split gate flash memory,long-term charge loss,nondecoding self-boosting operation,program and erase performances,reliable embedded memory,self-boosting function,split-gate flash technology,storage electrons,symmetric cells,symmetric floating gates,tip erase structure,flash memory,nonvolatile memory (nvm),self-recovery,split gate flash memory cells
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