High-aspect ratio through silicon via (TSV) technology

H B Chang,H Y Chen,P C Kuo,C H Chien,E B Liao, T C Lin, T S Wei, Y C Lin,Y H Chen,K F Yang,H A Teng,W C Tsai,Y C Tseng,S Y Chen,C C Hsieh, M F Chen,Y H Liu,T J Wu,S Y Hou, W C Chiou, S P Jeng,C H Yu

VLSI Technology（2012）

引用 17|浏览26

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摘要

The density of through-silicon-via (TSV) on CMOS chip is limited by TSV dimension and keep-out zone (KOZ). A high aspect ratio Cu TSV process, 2 μm × 30 μm, is demonstrated on 28nm CMOS baseline with good electrical performance and low cost. By implementing 2 μm × 30 μm TSV, the Si stress in the vicinity of TSV caused by thermal expansion is able to be relieved. It is, therefore, shown that the relaxation of TSV stress is correlated with minimized keep-out zone (KOZ). The achievement of excellent performance of 3D-IC yield and high aspect ratio TSV embedded device characteristics are key milestones in the promising manufacturability of 3D-IC by silicon foundry technology.

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关键词

cmos integrated circuits,copper,embedded systems,integrated circuit yield,silicon,stress relaxation,thermal expansion,three-dimensional integrated circuits,3d-ic yield,cmos chip,cu,koz,si,tsv dimension,tsv process,tsv technology,electrical performance,embedded device characteristics,high-aspect ratio,keep-out zone,size 28 nm,through silicon via,high aspect ratio,stress,strain

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