Thin Wafer Handling Process Evaluation for 3dic Integration

H. H. Chang,W. L. Tsai,C. H. Chien,H. C. Fu,C. W. Chiang,Y. H. Chen,W. C. Lo

2012 7TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT)（2012）

引用 8|浏览6

关键词

chemical vapour deposition,three-dimensional integrated circuits,wafer bonding,3DIC integration,A-glue,PECVD,adhesive selecting method,temporary bonding,thermal plastic thin wafer handling materials,thin wafer handling process evaluation,thinning process

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