SOI Substrate Removal for SEE Characterization: Techniques and Applications

Marty R. Shaneyfelt,James R. Schwank,Paul E. Dodd,Jeffrey Stevens,Gyorgy Vizkelethy,Scot E. Swanson,Scott M. Dalton

Radiation and Its Effects Components and Systems（2012）

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摘要

Techniques for removing the back substrate of SOI devices are described for both packaged devices and devices at the die level. The use of these techniques for microbeam, heavy-ion, and laser testing are illustrated.

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关键词

Substrates,Silicon,Gold,Etching,Contamination,Testing

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