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Low-K Interconnect Stack with Thick Metal 9 Redistribution Layer and Cu Die Bump for 45nm High Volume Manufacturing

D. Ingerly,S. Agraharam,D. Becher,V. Chikarmane,K. Fischer,R. Grover,M. Goodner, S. Haight,J. He,T. Ibrahim,S. Joshi,H. Kothari,K. Lee,Y. Lin,C. Litteken, H. Liu,E. Mays,P. Moon,T. Mule, S. Nolen, N. Patel, S. Pradhan, J. Robinson,P. Ramanarayanan, S. Sattiraju, T. Schroeder,S. Williams,P. Yashar

2008 International Interconnect Technology Conference（2008）

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