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HfSiON Gate Dielectric for 45nm Node Low-Power Device

Proceedings of the International Power Modulator Symposium and High Voltage Workshop/Proceedings of the International Power Modulator Symposium and High Voltage Workshop(2006)

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MOSFET,dielectric materials,hafnium compounds,high-k dielectric thin films,low-power electronics,oxygen compounds,semiconductor device breakdown,semiconductor device reliability,silicon compounds,45 nm,EOT stack film,HfSiON,PBTI lifetime,TDDB lifetime,breakdown voltage,gate dielectric,gate leakage reduction,interfacial oxide layer,low-power device,nMOS
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