Defect analysis and a new fault model for multi-port SRAMs

San Francisco, CA(2001)

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摘要
Semiconductor memory failures depend on the behavior of its components. This paper deals with testing of defects occurring in the memory cells of a multi-port memory. We also consider the resistive shorts between word/bit lines of same and different ports of the memory. The memory is modeled at the transistor level and analyzed for electrical defects by applying a set of patterns. Not only have existing models been taken into account in our simulation but also a new fault model for the multi-port memory is introduced. The boundaries of failure for the proposed defects are identified.
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关键词
SRAM chips,failure analysis,fault simulation,integrated circuit testing,multiport networks,defect testing,electrical fault model,failure analysis,multi-port SRAM,pattern set,resistive short,semiconductor memory cell,transistor-level model
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