Electromagnetic coupling to an enclosure via a wire penetration

Electromagnetic Compatibility, 2001. EMC. 2001 IEEE International Symposium(2001)

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摘要
This paper presents an efficient model, which can be computed in seconds, for the coupling of external electromagnetic fields to the contents of an enclosure via wire penetrations. The coupling path accounts for the coupling of an external electric field to a wire penetration that establishes an internal electric field via the connect and internal wire segment. The internal electric field then couples onto another victim wire segment, inside the box. The accuracy of the model is demonstrated by the good agreement obtained between predicted induced voltage on the victim wire segment, and experimental measurements
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electric fields,electromagnetic compatibility,electromagnetic coupling,electromagnetic fields,electromagnetic induction,electromagnetic shielding,voltage measurement,wires (electric),emc,dipole antenna model,electric dipole coupling,enclosure,external electric field coupling,external electromagnetic fields coupling,internal electric field,internal wire segment,multimode wire to wire coupling,predicted induced voltage,self impedance model,voltage measurements,wire penetrations,wire to waveguide mode coupling,voltage,frequency,dipole antennas,equivalent circuits,impedance,electromagnetic modeling
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