A novel 1T1C capacitor structure for high density FRAM

In this paper, an etching damage-free 4 Mb ferroelectric random access memory (FRAM) integration technology was for the first time developed using ferroelectric (FE) hole capacitor structure. Since the PZT capacitors are not etched, no etching damage was generated in the novel capacitor structure. The etching process issue, which is one of most critical obstacles for scaling down FRAM device, is completely resolved by using this novel FE hole structure. Therefore, the novel integration technology strongly promises to provide a reliable scaling down of FRAM device beyond 0.25 /spl mu/m technology generation.