Evaluation of wirebond and flip-chip interconnects of a leadless plastic package for RF applications

M Engl,Klaus Pressel,Horst Theuss,Jochen Dangelmaier,W Eurskens,H Knapp,Werner Simbuerger,Robert Weigel

Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th（2005）

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摘要

We present a comparison of flip chip and wirebond first level interconnects used in a leadless plastic package with respect to high frequency performance. We apply numerical analysis and experimental measurements on high frequency devices. We show that flip chip interconnects provide superior electrical performance compared to wirebonds. This is demonstrated by reduced losses and less parasitic effects

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关键词

flip-chip devices,interconnections,lead bonding,plastic packaging,reliability,rf applications,electrical performance,flip-chip interconnects,high frequency performance,leadless plastic package,parasitic effects,wirebond interconnects,high frequency,numerical analysis,flip chip

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