Si/sub 1-x-y/Ge/sub x/C/sub y/ alloys: an enabling technology for scaled high performance silicon-based heterojunction devices

Ann Arbor, MI, USA(1998)

引用 1|浏览2
暂无评分
摘要
Si/Si/sub 1-x/Ge/sub x/ heterostructures have traditionally faced both fundamental and practical limitations in their applications to advanced device technology. These hurdles have been most significantly been the well known critical thickness limitation for pseudomorphic growth and the less known sensitivity of devices to heterojunction process integration. In this paper, we review how Si/sub 1-x-y/Ge/sub x/C/sub y/ alloys grown by rapid thermal chemical vapor deposition (RTCVD) are an enabling technology to overcome both these fundamental and practical issues. Examples are shown for sub-100-nm MOS devices.
更多
查看译文
关键词
ge-si alloys,mosfet,chemical vapour deposition,diffusion,heterojunction bipolar transistors,rapid thermal processing,semiconductor growth,semiconductor heterojunctions,semiconductor materials,rtcvd,si-based heterojunction devices,si/sub 1-x-y/ge/sub x/c/sub y/ alloys,sigec,chemical vapor deposition,critical thickness limitation,dopant diffusion,enabling technology,heterojunction process integration,pseudomorphic growth,rapid thermal cvd,scaled high performance devices,ultrashort channel mos devices
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要