A study of the reliability of mosfets in two stacked thin chips for 3D system in package
ieee（2005）
关键词
mos integrated circuits,mosfet,flip-chip devices,integrated circuit interconnections,integrated circuit reliability,multichip modules,radio equipment,semiconductor device reliability,3d system in package,mosfet reliability,rf wireless communication systems,analog cmos,bump interconnection,digital cmos,flip chip stacking process,heat radiation,passive components,sensors,stacked chips,stacked thin chips,flip chip,wireless communication,packaging,rough surfaces,chip,surface roughness,system in package,stacking,testing,fabrication
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