Optoelectronic packaging technology development of a high density 32-channel 16 Gbps optical data link for the optoelectronic technology consortium (OETC)

Wong, Y.M., Muehlner, D.J., Gates, J.V., Anthony, P.J.

Lasers and Electro-Optics Society Annual Meeting, 1994. LEOS '94 Conference Proceedings. IEEE（1994）

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摘要

Summary form only given. A parallel, 32 channel, high density (140 μm pitch) 500 Mbps/channel NRZ optical data link has been successfully fabricated using existing GaAs IC, silicon optical bench, and multichip module technologies. Packaging designs, its implementation, and link characterization will be discussed

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关键词

optical fibre networks,140 mum,16 Gbit/s,32-channe,GaAs,GaAs IC,NRZ optical data link,Si,high density,link characterization,multichip module technologies,optical data link,optoelectronic packaging technology development,optoelectronic technology consortium,packaging designs,silicon optical bench,

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