Measurement and simulation of simultaneous switching noise in the multi-reference plane package

Steven G Rosser,Michael K Kerr,Chi Shih Chang,Jiayuan Fang,Zhaoqing Chen,Y Chen

Orlando, FL（1996）

引用 11|浏览3

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摘要

A simplified laboratory experiment representing simultaneously switching circuits in a multi-reference plane package is described. Experimental data is compared to theoretical calculations and to simulated data from three modeling techniques of progressive complexity, including lumped element, hybrid lumped element/transmission line, and full wave solutions. The merits and limitations of each technique are presented

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关键词

integrated circuit noise,integrated circuit packaging,full wave model,hybrid lumped element/transmission line model,lumped element model,multi-reference plane package,simulation,simultaneous switching noise,packaging,noise measurement,transmission line,noise shaping

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