60-GHz OOK multi-chip transceiver modules for multi-Gbps wireless communications

Microwave Conference(2014)

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摘要
Transmitter and receiver modules for 60-GHz multi-gigabit per second (multi-Gbps) communications are presented. The On-Off-Keying (OOK) modulation scheme is utilized to minimize the system complexity and thus the power consumption. The transmitter module consists of voltage-controlled oscillator (VCO), OOK modulator and medium-power power amplifier (PA), while the receiver requires only low-noise amplifier (LNA) and OOK demodulator. All circuits are fabricated in a 0.25-μm SiGe BiCMOS process. Bondwire compensation structures are utilized to mitigate the reflections caused by bondwire interfaces. Wireless measurements at 54 cm with 20-dBi horn antennas resulted in an error-free transmission at 4.5 Gbps. The complete transceiver chipset consumes 396 mW.
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bicmos integrated circuits,ge-si alloys,amplitude shift keying,demodulators,field effect mimic,horn antennas,low noise amplifiers,millimetre wave power amplifiers,power consumption,radio transceivers,voltage-controlled oscillators,lna,ook demodulator,ook multichip transceiver modules,sige,sige bicmos process,vco,bit rate 4.5 gbit/s,bondwire compensation structures,bondwire interfaces,error-free transmission,frequency 60 ghz,low-noise amplifier,medium-power power amplifier,multigbps wireless communications,multigigabit per second ommunications,on-off-keying modulation scheme,power 396 mw,receiver modules,size 0.25 mum,transmitter modules,voltage controlled oscillator,wireless measurements,transmitters,wireless communication,transceivers,baseband,modulation
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