Electromigration challenges for advanced on-chip Cu interconnects.

Baozhen Li,Cathryn Christiansen,Dinesh Badami,Chih-Chao Yang

Microelectronics Reliability（2014）

引用 52|浏览29

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摘要

•Electromigration challenges for advanced Cu interconnects due to technology scaling.•Measures and innovations in process integration to enhance EM performance.•EM aware circuit design to meet the reliability challenges.•Chip integration to ensure EM reliability for products.

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