Transistor Matching and Fin Angle Variation in FinFET Technology

Electron Devices, IEEE Transactions  (2015)

引用 10|浏览1
暂无评分
摘要
The introduction of FinFET architecture was expected to alleviate the issue of mismatch compared with planar technology, given the lower doping levels required. However, several authors have reported better mismatch results for planar technology suggesting additional challenges for FinFET architecture. An additional mechanism previously not considered arising from charge present at points of disturbance in the silicon lattice in tapering and wavering fins is shown to contribute to transistor mismatch. We show that including this mechanism improves the quantitative understanding of mismatch in FinFETs.
更多
查看译文
关键词
mosfet,semiconductor doping,finfet technology,doping levels,fin angle variation,planar technology,silicon lattice,transistor matching,wavering fins,avt,finfet,fin angle,mismatch,taper,taper.,strips,silicon,threshold voltage,lattices
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要