A method to maintain phase-change memory pre-coding data retention after high temperature solder bonding process in embedded systems

H.L. Lung,Matthew J. Breitwisch,Jau-Yi Wu,P. Y. Du,Yu Zhu,Ming-Hsiu Lee, Y.H. Shih,Erh-Kun Lai,R. Dasaka,Tien-Yen Wang,Chieh-Fang Chen,Roger W. Cheek, A. G. Schrott,Eric A. Joseph,Huai-Yu Cheng,Simone Raoux,C. Lam

Digest of Technical Papers - Symposium on VLSI Technology（2011）

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摘要

For the first time we demonstrate that a Phase Change Memory (PCM) packaged chip can hold pre-coded data after an industrial standard lead free solder bonding reflow process. Good “0” and “1” state distributions are retained in a 90nm 128Mb PCM chip after the soldering process. Furthermore, the tested chip endures more than 10 million write cycles after the pre-coding and high temperature process.

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关键词

embedded systems,embedded system,lead,soldering,precoding,phase change memory,integrated circuit packaging,resistance

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