Mushroom-Type Ground Plane Structure for Wideband SSN Suppression in High-Speed Circuits
Microwave and Wireless Components Letters, IEEE（2011）
摘要
A novel design of ground plane with mushroom-type structures is proposed for wideband suppression of simultaneous switching noise (SSN) in high-speed printed circuit boards. The mushroom-type ground plane (MGP) structure consists of two square patches which are connected to the ground plane by specially designed traces and vias. It is more compact than the mushroom-type electromagnetic bandgap (MEBG) structure where the whole middle layer is occupied by periodic patches. Simulation and measurement results show that the SSN is suppressed significantly by the MGP. A -30 dB suppression bandwidth extending from 600 MHz to 7.5 GHz is achieved by a modified MGP structure.
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关键词
localized suppression,simultaneous switching noise (ssn),mushroom-type ground plane structure,high-speed printed circuit board,wideband ssn suppression,mushroom-type ground plane (mgp),simultaneous switching noise,photonic band gap,broadband networks,high-speed integrated circuits,printed circuits,mgp structure,interference suppression,two square patch,high-speed circuit,mushroom-type electromagnetic bandgap structure,inductance,cutoff frequency,noise measurement,printed circuit board,resonant frequency
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