Burn-In Screening Technology Of Power Bare Die

his paper focuses on the Burn-in Screening Technology of Power Bare Die. A temporary carrier that allows the power bare die full temperature testing and burn-in has been described. A suitable improvement multi-bump contact carrier technology has been put forward and Experiment results have shown that the contact resistance of the new carrier decrease 40% significantly. Base on the peak value junction temperature controlling, A more effective power bare die pulse full power burn-in screening technology have been proposed, which power bare dies would be burn-in screened by 100%. So the high quality and reliability requirements for bare power die of MCM and SiP are met..