The experimental research of the non-brasive cryogenic polishing monocrystalline silicon wafer super-smooth surface

Following the development of IC technology, the IC is developed as high density, high integration, and high-performance. It requires that the semiconductor materials should have super-smooth surfaces in the process of machining chips. In this paper, the new technology of ice disc polishing to polish monocrystalline silicon without abrasive on the cryogenic condition is first put forward. The results of the experiment were recorded in detail. In this experiment, some factors on the impact of surface quality are analyzed. © 2010 IEEE.